Nitto Denko Electronics (M)-Research and Development

Nitto Denko Malaysia has two groups in Malaysia: Nitto Denko Electronic (Malaysia Sdn Bhd (NIDEM) and Nitto Denko Materials (Malaysia) Sdn Bhd (NMM), both of which have a research and development center.

The NIDEM R&D Center was established in April 2002 and is engaged in product design and semiconductor encapsulation materials and customer spec-in activities. The NMMR&D, meanwhile, began its activities in January 2004 in response to South Asia needs in the area of electronics related adhesive tape products. The two R&D Centers together are referred to as the Nitto Denko Malaysia R &D Centers.

The R&D Centers both will respond rapidly to customers’ need and deliver new product in a timely manner. Operation (semiconductor encapsulation material) on a trial production, evaluation and other research activities is on a 24-basis.

Supported by senior researchers from Nitto Denko Japan, the R&D Centers employ the latest high-end evaluation and state-of –art equipment. Our R&D Centers are recognized as two of the select few outside Japan specializing in Encapsulation Molding Compound and Adhesive Tape Technology.

Our researchers are not only aggressively pursuing development of existing products but also in researching new values and application such as environmental friendly products which are free of solvent and other hazardous substances.

The pace of semiconductor technology and electronics industry is so rapid that the role of R&D has become vital and critical in supporting and keeping pace with our customers’ technological vision. With our R&D centers, our customers are of continuous support and having their future requirement met.